Large area fine line patterning by scanning projection lithography

Author

Muller, Heinrich G. ; Yuan, Yanrong ; Sheets, Ronald E.

Author_Institution

TAMARACK Sci., Anaheim, CA, USA

Volume

18

Issue

1

fYear

1995

fDate

2/1/1995 12:00:00 AM

Firstpage

33

Lastpage

36

Abstract

A new type of photolithography tool has been developed, addressing the specific needs of MCM manufacture. It is based on scanning projection exposure. It can expose panels at variable sizes up to 500 mm by 600 mm (typical laminate size), with an optical resolution of less than 5 μm and an overlay accuracy of 2 μm (typical thin film design rules). With the exposure being a mask projection, mask damage and subsequent yield problems are generally avoided

Keywords

laser ablation; masks; multichip modules; photolithography; 2 micron; 500 mm; 600 mm; MCM manufacture; laminate size; large area fine line patterning; mask damage; mask projection; optical resolution; overlay accuracy; photolithography tool; scanning projection exposure; scanning projection lithography; thin film design rules; yield problems; Costs; Geometrical optics; Laminates; Lithography; Manufacturing; Optical design; Optical distortion; Optical films; Space technology; Substrates;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.365479

Filename

365479