Reliability comparison of two metallurgies for ceramic ball grid array

Author

Banks, Donald R. ; Burnette, T.E. ; Gerke, R. David ; Mammo, Ephraim ; Mattay, Shyam

Author_Institution

Adv. Packaging Technol., Motorola Inc., Austin, TX, USA

Volume

18

Issue

1

fYear

1995

fDate

2/1/1995 12:00:00 AM

Firstpage

53

Lastpage

57

Abstract

Surface-mountable ceramic ball grid array (CBGA) packages have proven to be attractive in a variety of applications as designers seek to maximize electrical performance, reduce card real estate, and improve manufacturing process yields. In support of the PowerPC family of microprocessors, 21 mm CBGA packages (256 leads) were used to evaluate two different ball metallurgies-90/10 Pb/Sn and 62/36/2 Sn/Pb/Ag. Test modules were assembled to printed circuit cards and cycled at 0 to 100°C and -40 to 125°C to evaluate the relative fatigue behavior of the interconnections. Ball attach techniques and module-to-card assembly processes are described, including screening, placement, and reflow. Failure mechanisms and fatigue reliability are discussed for both metallurgies

Keywords

assembling; circuit reliability; failure analysis; fatigue; printed circuit manufacture; reflow soldering; surface mount technology; -40 to 125 C; 21 mm; Pb-Sn; PowerPC family; SMD; SMT; Sn-Pb-Ag; ball attach techniques; ceramic ball grid array; failure mechanisms; fatigue reliability; interconnections; microprocessors; module-to-card assembly processes; placement; reflow; relative fatigue behavior; reliability comparison; screening; surface-mountable CBGA packages; Assembly; Ceramics; Circuit testing; Electronics packaging; Fatigue; Lead; Manufacturing processes; Microprocessors; Printed circuits; Tin;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.365483

Filename

365483