Title :
Reliability comparison of two metallurgies for ceramic ball grid array
Author :
Banks, Donald R. ; Burnette, T.E. ; Gerke, R. David ; Mammo, Ephraim ; Mattay, Shyam
Author_Institution :
Adv. Packaging Technol., Motorola Inc., Austin, TX, USA
fDate :
2/1/1995 12:00:00 AM
Abstract :
Surface-mountable ceramic ball grid array (CBGA) packages have proven to be attractive in a variety of applications as designers seek to maximize electrical performance, reduce card real estate, and improve manufacturing process yields. In support of the PowerPC family of microprocessors, 21 mm CBGA packages (256 leads) were used to evaluate two different ball metallurgies-90/10 Pb/Sn and 62/36/2 Sn/Pb/Ag. Test modules were assembled to printed circuit cards and cycled at 0 to 100°C and -40 to 125°C to evaluate the relative fatigue behavior of the interconnections. Ball attach techniques and module-to-card assembly processes are described, including screening, placement, and reflow. Failure mechanisms and fatigue reliability are discussed for both metallurgies
Keywords :
assembling; circuit reliability; failure analysis; fatigue; printed circuit manufacture; reflow soldering; surface mount technology; -40 to 125 C; 21 mm; Pb-Sn; PowerPC family; SMD; SMT; Sn-Pb-Ag; ball attach techniques; ceramic ball grid array; failure mechanisms; fatigue reliability; interconnections; microprocessors; module-to-card assembly processes; placement; reflow; relative fatigue behavior; reliability comparison; screening; surface-mountable CBGA packages; Assembly; Ceramics; Circuit testing; Electronics packaging; Fatigue; Lead; Manufacturing processes; Microprocessors; Printed circuits; Tin;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
