Title :
Concurrent packaging architecture design
Author :
Cao, Lipeng ; Krusius, J. Peter
Author_Institution :
Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
fDate :
2/1/1995 12:00:00 AM
Abstract :
Packaging constitutes one of the primary limits on the performance and partitioning of high density electronic systems. A concurrent design methodology for the design of physical packaging hierarchies is presented. Architecture, electrical performance, and energy management aspects of the system are included. The CAD system AUDIT implements this design methodology. The concurrent design capability has been illustrated using model systems derived from high speed Digital Equipment 3000/500 (Alpha) and IBM RS/6000 workstations. It is found that the choice of the packaging architecture as well as the impact of packaging on system performance is determined by the partitioning of the system
Keywords :
CAD; concurrent engineering; electronic engineering computing; packaging; AUDIT; CAD system; concurrent design; design methodology; packaging architecture design; Central Processing Unit; Circuit simulation; Design automation; Design methodology; Electronics packaging; Energy management; Integrated circuit modeling; Packaging machines; Power system modeling; Wiring;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
