Title :
Algorithms for coupled transient simulation of circuits and complicated 3-D packaging
Author :
Silveira, Luís Miguel ; Kamon, Mattan ; White, Jacob
Author_Institution :
Res. Lab. of Electron., MIT, Cambridge, MA, USA
fDate :
2/1/1995 12:00:00 AM
Abstract :
Techniques are described for coupled simulation of complicated 3-D interconnect and nonlinear transistor drivers and receivers. The approach is based on combining: multipole-accelerated method-of-moments techniques for extracting frequency-dependent inductances and resistances for the interconnect; a sectioning method for fitting the frequency-domain data with a rational function; a balanced-realization approach to reducing the order of the rational function in a guaranteed stable manner; and an implementation of fast recursive convolution to incorporate the rational function in SPICE3. Results are presented to demonstrate some of the frequency-dependent effects in a packaging analysis problem
Keywords :
SPICE; circuit analysis computing; convolution; distributed parameter networks; driver circuits; inductance; integrated circuit interconnections; method of moments; packaging; transient analysis; 3D packaging; SPICE3; balanced-realization approach; coupled transient simulation; fast recursive convolution; frequency-dependent inductances; frequency-dependent resistances; frequency-domain data; interconnect; method-of-moments techniques; multipole-accelerated moment methods; nonlinear transistor drivers; nonlinear transistor receivers; packaging analysis problem; rational function; sectioning method; Circuit simulation; Conductors; Convolution; Coupling circuits; Electronics packaging; Frequency; Inductance; Integrated circuit interconnections; Transmission line matrix methods; Voltage;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
