Title :
A 3-D electromagnetic simulator for high frequency applications
Author_Institution :
Zeland Software Inc., Fremont, CA, USA
fDate :
2/1/1995 12:00:00 AM
Abstract :
A general purpose full-wave electromagnetic simulator IE3-D has been developed for the analysis and design of high-frequency and high-speed electronic circuit structures. For an arbitrarily shaped 3-D metallic layered structure, the integral equation, and method of moment-based simulator solves the current distribution on the structure expanded into roof-top functions on a set of 3-D triangular and rectangular cells. The circuit parameters are extracted from the solved current distribution in the form of either S-parameters frequency response and RLC-equivalent circuit in SPICE format
Keywords :
S-parameters; SPICE; circuit analysis computing; current distribution; digital circuits; digital simulation; equivalent circuits; frequency response; integral equations; method of moments; microwave circuits; packaging; 3D electromagnetic simulator; 3D rectangular cells; 3D triangular cells; IE3-D; RLC-equivalent circuit; S-parameters frequency response; SPICE format; circuit parameters; current distribution; full-wave EM simulator; high frequency applications; high-speed electronic circuits; integral equation; method of moment-based simulator; roof-top functions; Algorithm design and analysis; Analytical models; Circuit simulation; Coupling circuits; Current distribution; Electromagnetic analysis; Electromagnetic radiation; Electronic circuits; Frequency; Integral equations;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
