Electrical design of an MCM package for a multi-processor digital system

Author

Sarfaraz, Ali ; Swaminathan, Madhavan ; Crocker, Jim ; Bhatia, Harsaran ; Nealon, Michael

Author_Institution

IBM Microelectronics, East Fishkill, NY, USA

Volume

18

Issue

1

fYear

1995

fDate

2/1/1995 12:00:00 AM

Firstpage

127

Lastpage

143

Abstract

The electrical design of a Ceramic Multichip Module (MCM-C) CPU node for a multiprocessor parallel system has been presented. The electrical performance of the package has been evaluated through modeling and simulation using models that provide both qualitative as well as quantitative measures on signal integrity, coupled noise and switching noise that are required to guarantee proper system operation. Details on the techniques used to optimize the MCM package have also been explained in this paper

Keywords

integrated circuit noise; integrated circuit packaging; multichip modules; multiprocessing systems; MCM package; ceramic multichip module; coupled noise; electrical design; electrical performance; multiprocessor digital system; multiprocessor parallel system; signal integrity; switching noise; Central Processing Unit; Circuits; Digital systems; Frequency; High performance computing; Multichip modules; Packaging machines; Power transmission lines; Semiconductor device noise; Semiconductor device packaging;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.365499

Filename

365499