Title :
Electrical design of an MCM package for a multi-processor digital system
Author :
Sarfaraz, Ali ; Swaminathan, Madhavan ; Crocker, Jim ; Bhatia, Harsaran ; Nealon, Michael
Author_Institution :
IBM Microelectronics, East Fishkill, NY, USA
fDate :
2/1/1995 12:00:00 AM
Abstract :
The electrical design of a Ceramic Multichip Module (MCM-C) CPU node for a multiprocessor parallel system has been presented. The electrical performance of the package has been evaluated through modeling and simulation using models that provide both qualitative as well as quantitative measures on signal integrity, coupled noise and switching noise that are required to guarantee proper system operation. Details on the techniques used to optimize the MCM package have also been explained in this paper
Keywords :
integrated circuit noise; integrated circuit packaging; multichip modules; multiprocessing systems; MCM package; ceramic multichip module; coupled noise; electrical design; electrical performance; multiprocessor digital system; multiprocessor parallel system; signal integrity; switching noise; Central Processing Unit; Circuits; Digital systems; Frequency; High performance computing; Multichip modules; Packaging machines; Power transmission lines; Semiconductor device noise; Semiconductor device packaging;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
