DocumentCode
1245962
Title
Open repair technologies for MCM-D
Author
Wassick, Thomas A. ; Economikos, Laertis
Author_Institution
IBM Microelectronics, Hopewell Junction, NY, USA
Volume
18
Issue
1
fYear
1995
fDate
2/1/1995 12:00:00 AM
Firstpage
154
Lastpage
162
Abstract
IBM has developed various technologies for repairing defects in thin film circuitry, primarily for Multichip Module (MCM) applications. This paper discusses five technologies: laser chemical vapor deposition (LCVD), wire bond, laser-sonic bonding, solder repair, and self-induced repair, with focus on the process parameters and tooling aspects of the three established in IBM´s production environment
Keywords
chemical vapour deposition; integrated circuit packaging; laser deposition; lead bonding; maintenance engineering; multichip modules; soldering; IBM; MCM-D; laser chemical vapor deposition; laser-sonic bonding; open repair technologies; process parameters; production environment; self-induced repair; solder repair; thin film circuitry; tooling aspects; wire bond; Bonding; Chemical lasers; Chemical technology; Chemical vapor deposition; Circuits; Costs; Packaging; Transistors; Wire; Wiring;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1070-9894
Type
jour
DOI
10.1109/96.365502
Filename
365502
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