Title :
Open repair technologies for MCM-D
Author :
Wassick, Thomas A. ; Economikos, Laertis
Author_Institution :
IBM Microelectronics, Hopewell Junction, NY, USA
fDate :
2/1/1995 12:00:00 AM
Abstract :
IBM has developed various technologies for repairing defects in thin film circuitry, primarily for Multichip Module (MCM) applications. This paper discusses five technologies: laser chemical vapor deposition (LCVD), wire bond, laser-sonic bonding, solder repair, and self-induced repair, with focus on the process parameters and tooling aspects of the three established in IBM´s production environment
Keywords :
chemical vapour deposition; integrated circuit packaging; laser deposition; lead bonding; maintenance engineering; multichip modules; soldering; IBM; MCM-D; laser chemical vapor deposition; laser-sonic bonding; open repair technologies; process parameters; production environment; self-induced repair; solder repair; thin film circuitry; tooling aspects; wire bond; Bonding; Chemical lasers; Chemical technology; Chemical vapor deposition; Circuits; Costs; Packaging; Transistors; Wire; Wiring;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
