Title :
The effect of wirebond geometry and die setting on wire sweep
Author :
Tay, A.A.O. ; Yeo, K.S. ; Wu, J.H.
Author_Institution :
Centre for IC Failure Anal. & Reliability, Nat. Univ. of Singapore, Singapore
fDate :
2/1/1995 12:00:00 AM
Abstract :
An effective and convenient method is presented for describing wirebond geometry. The method employs a minimum number of geometric parameters which are directly related to the IC package design. Computational simulation of wirebond behavior with in-plane flow load is carried out. A 2-D creep flow model is used to predict the velocity distribution and the flow load acting on the wirebond. A finite element method, which allows for plastic deformation and large deflection, is used to predict the deformation of and stress distribution in the, wirebond. Comparative analyses of wirebond behavior with different die settings and loop profiles are carried out. The buckling of wirebonds with in-plane flow load is also studied. Very interesting results have been obtained. The numerical results will be useful for the optimal design of IC packages
Keywords :
buckling; creep; finite element analysis; integrated circuit interconnections; integrated circuit packaging; lead bonding; plastic deformation; stress analysis; 2D creep flow model; FEM; IC package design; IC packages; die setting; finite element method; geometric parameters; in-plane flow load; loop profiles; plastic deformation; stress distribution; velocity distribution; wire sweep; wirebond geometry; Computational modeling; Computer aided manufacturing; Creep; Finite element methods; Geometry; Integrated circuit packaging; Plastics; Predictive models; Stress; Wire;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
