DocumentCode :
1246372
Title :
Transient temperature fields with general nonlinear boundary conditions in electronic systems
Author :
Gerstenmaier, York C. ; Wachutka, Gerhard K M
Author_Institution :
Corporate Technol. Dept., Siemens AG, Muenchen, Germany
Volume :
28
Issue :
1
fYear :
2005
fDate :
3/1/2005 12:00:00 AM
Firstpage :
23
Lastpage :
33
Abstract :
Green´s function representations of the solution of the heat conduction equation for general boundary conditions are generalized for the nonlinear, i.e., temperature dependent case. Temperature dependent heat transfer coefficients lead to additional terms in the Green´s function representation of the temperature field. For a rectangular structure with averaged homogeneous material parameters several types of Green´s functions can be chosen especially simple, because of the new representation with the possibility of differing types of boundary conditions for the temperature field and the Green´s function. Exact finite closed form expressions for three-dimensional-Green´s functions in the time domain using elliptic theta functions are presented. The temperature field is a solution of a nonlinear integral equation which is solved numerically by iteration. The resulting algorithm is very robust, stable and accurate with reliable convergence properties and avoids matrix inversions completely. The algorithm can deal with all sizes of volume heat sources without additional grid generation. Large and small size volume heat sources are treated simultaneously in the calculations that will be presented. Heat transfer coefficients are chosen representing radiative and convective boundary conditions. An extension of the solution algorithm to composed multilayer systems of arbitrary geometry is outlined.
Keywords :
Green´s function methods; boundary-value problems; heat conduction; integral equations; nonlinear functions; time-domain analysis; Green function; convergence properties; electronic systems; elliptic theta functions; grid generation; heat conduction equation; heat sources; heat transfer coefficients; homogeneous material parameters; matrix inversions; multichip modules; nonlinear boundary conditions; nonlinear integral equation; time domain analysis; transient temperature field; Boundary conditions; Conducting materials; Green´s function methods; Heat transfer; Integral equations; Mesh generation; Nonhomogeneous media; Nonlinear equations; Robustness; Temperature dependence; Multi-chip-modules (MCMs); nonlinear heat conduction with Green´s function method; radiative and convective boundary conditions; thermal transient modeling;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2004.843186
Filename :
1402608
Link To Document :
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