• DocumentCode
    1246378
  • Title

    Minimizing the uncertainties associated with the measurement of thermal properties by the Transient thermo-reflectance method

  • Author

    Burzo, Mihai G. ; Komarov, Pavel L. ; Raad, Peter E.

  • Author_Institution
    Mech. Eng. Dept., Southern Methodist Univ., Dallas, TX, USA
  • Volume
    28
  • Issue
    1
  • fYear
    2005
  • fDate
    3/1/2005 12:00:00 AM
  • Firstpage
    39
  • Lastpage
    44
  • Abstract
    An approach for optimizing the transient thermo-reflectance (TTR) measurement of thermal properties is presented. The influence of the most important parameters of the system on the accuracy of the TTR measurements is investigated. An overall performance criterion is defined based on the responsivity of a given system and the thermoreflectance coefficient of the sample under test. It is shown that in order to obtain the smallest measurement uncertainty one should use a metallic absorption layer with the highest possible thermoreflectance coefficient and then compute the optimum thickness of that layer by maximizing the responsivity of the TTR system. The responsivity represents the sensitivity of the TTR method to the measurement of the thermal properties of a sample and relates the overall uncertainty of a TTR measurement to the uncertainties associated with the TTR apparatus.
  • Keywords
    measurement uncertainty; thermal conductivity measurement; thermoreflectance; interface resistance; measurement uncertainty; metallic absorption layer; responsivity; thermal conductivity measurement; thermal properties; thermoreflectance coefficient; transient thermo-reflectance method; Conducting materials; Conductivity measurement; Dielectric measurements; Heating; Optical films; Optical materials; Pulse measurements; Thermal conductivity; Thermoreflectance; Ultrafast optics; Interface resistance; laser-based; non-invasive; responsivity; thermal conductivity measurement; thermoreflectance coefficient; transient thermo-reflectance (TTR);
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2004.843189
  • Filename
    1402610