Development of a high performance heat Sink Based on screen-fin technology

Author

Li, Chen ; Wirtz, R.A.

Author_Institution

Mech. Eng. Dept., Univ. of Nevada, Reno, NV, USA

Volume

28

Issue

1

fYear

2005

fDate

3/1/2005 12:00:00 AM

Firstpage

80

Lastpage

87

Abstract

In this paper, a novel high-performance heat sink based on screen-fin technology is described. The structural features of the heat sink are presented. The apparatus to measure both the pressure drop and heat transfer performance are described. Correlation equations of friction factor and Colburn-j factor as a function of screen-fin orientation, coolant properties and flow rate through the mesh are formulated. A semi-empirical model is used to predict the heat exchanger pressure drop, thermal performance and to design prototype heat sinks. Prototypes are built and tested. By screen-fin technology, the best performance of this kind of heat sink with external dimensions: 76.2-mm-wide, 63.5-mm-deep with 38.1-mm-high screen-laminate fins is 4.3W/°C at 62.3-Pa pressure drop of air flow through the heat sink.

Keywords

heat exchangers; heat sinks; laminates; thermal management (packaging); 38.1 mm; 62.3 Pa; 63.5 mm; 76.2 mm; Colburn-j factor; air flow; coolant properties; correlation equation; flow rate; friction factor; heat exchanger pressure drop; heat transfer performance; high performance heat sink; screen-fin technology; screen-laminate fins; semi-empirical model; serpentine configuration; thermal performance; Bonding; Costs; Electronic packaging thermal management; Electronics cooling; Friction; Geometry; Heat sinks; Heat transfer; Prototypes; Thermal conductivity; Heat sink; high performance; screen-fin; serpentine configuration;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/TCAPT.2004.843171

Filename

1402616