• DocumentCode
    1246420
  • Title

    Heat removal by aluminum-foam heat sinks in a multi-air jet impingement

  • Author

    Kim, Seo Young ; Lee, Myung Ho ; Lee, Kwan-Soo

  • Author_Institution
    Thermal/Flow Control Res. Center, Korea Inst. of Sci. & Technol., Seoul, South Korea
  • Volume
    28
  • Issue
    1
  • fYear
    2005
  • fDate
    3/1/2005 12:00:00 AM
  • Firstpage
    142
  • Lastpage
    148
  • Abstract
    The present experiment investigates the effects of the pore density of aluminum foam heat sinks, the jet velocity, the jet-to-jet spacing and the nozzle plate-to-heated surface separation distance in a 3×3 square multi-jet impinging array on the averaged Nusselt number. Thermal performances of 10, 20, and 40 PPI (pores per inch) aluminum foam heat sinks and a conventional plate-fin heat sink are evaluated in terms of the averaged Nusselt number. The jet Reynolds number is varied in the range of Re=1000-13650. The highly permeable 10 PPI aluminum foam heat sink shows higher Nusselt numbers than the 20 and 40PPI aluminum foam heat sinks both in the multi-jet and the single jet impingements. For the single jet impingement, the aluminum foam heat sinks display 8-33% higher thermal performance compared to a conventional plate-fin heat sink while the enhancement is 2-29% for the multi-jet impingement. The multi-jet impingement shows higher heat transfer enhancement than the single jet impingement for high jet Reynolds number and smaller jet-to-jet spacing in the present experiment.
  • Keywords
    aluminium; flow; foams; heat sinks; heat transfer; jets; Nusselt number; Reynolds number; aluminum-foam heat sinks; electronics cooling; heat removal; heat transfer enhancement; jet velocity; jet-to-jet spacing; multi-air jet impingement; multi-jet impinging array; nozzle plate-to-heated surface separation; plate-fin heat sink; pore density; Aluminum; Displays; Electronics cooling; Heat sinks; Heat transfer; Multiaccess communication; Performance evaluation; Telephone sets; Temperature; Thermal conductivity; Aluminum foam heat sink; electronics cooling; multi-jet impingement; plate-fin heat sink; single jet impingement;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2004.843169
  • Filename
    1402624