DocumentCode :
1246721
Title :
Sub-20 ps high-speed ECL bipolar transistor with low parasitic architecture
Author :
Iinuma, Toshihiko ; Itoh, Nobuyuki ; Nakajima, Hiroomi ; Inou, Kazumi ; Matsuda, Satoshi ; Yoshino, Chihiro ; Tsuboi, Yoshiroh ; Katsumata, Yasuhiro ; Iwai, Hisato
Author_Institution :
ULSI Res. Center, Toshiba Corp., Kawasaki, Japan
Volume :
42
Issue :
3
fYear :
1995
fDate :
3/1/1995 12:00:00 AM
Firstpage :
399
Lastpage :
405
Abstract :
Reducing parasitic capacitance and resistance is an effective means of both improving ECL gate delay and increasing fT values. In this paper, we demonstrate a device with sub-20 ps tpd values even at fT=23 GHz, a performance which has been achieved by implementing a number of techniques. These include 1) low-stress deep- and shallow-trench isolation to reduce CCB, 2) a low-concentration collector design to reduce CCB, 3) NiSi-salicided base and emitter electrodes to reduce RB, and 4) a shallow base formed by double diffusion technology for relatively high fT with a low-concentration collector design. The low-concentration collector design gives the device a high breakdown voltage of 6.2 V
Keywords :
bipolar transistors; emitter-coupled logic; isolation technology; semiconductor technology; 20 ps; 23 GHz; 6.2 V; NiSi-Si; NiSi-salicided base electrodes; NiSi-salicided emitter electrodes; breakdown voltage; cut off frequency; double diffusion technology; gate delay; high-speed ECL bipolar transistor; low-concentration collector design; low-stress deep-trench isolation; low-stress shallow-trench isolation; parasitic capacitance; parasitic resistance; shallow base; Bipolar transistors; Cutoff frequency; Delay effects; Electrodes; Epitaxial growth; Germanium silicon alloys; Parasitic capacitance; Roentgenium; Senior members; Silicon germanium;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.368035
Filename :
368035
Link To Document :
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