• DocumentCode
    1247315
  • Title

    On the impact of on-chip inductance on signal nets under the influence of power grid noise

  • Author

    Chen, Tom

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Colorado State Univ., Fort Collins, CO, USA
  • Volume
    13
  • Issue
    3
  • fYear
    2005
  • fDate
    3/1/2005 12:00:00 AM
  • Firstpage
    339
  • Lastpage
    348
  • Abstract
    It has been well recognized that the impact of on-chip inductance on some critical nets, such as clock nets, is significant and cannot be ignored in delay modeling for these nets. However, the impact of on-chip inductance on signal nets in general is still not well understood. We present results of analyzing inductive effects on signal nets for ultradeep submicron technologies under the influence of power grid noise. The analysis is based on an Al-based 0.18-/spl mu/m CMOS process and a Cu-based 0.13-/spl mu/m CMOS process. The impact of on-chip inductance is shown to be insignificant if we assume a perfect power supply network around the interconnect routes. Otherwise, the impact of on-chip inductance can be significant. Furthermore, the results presented in this paper illustrate the impact of on-chip inductance one would expect from transitioning from an Al-based interconnect technology to a Cu-based interconnect technology. A heuristic method is proposed in the paper to account for the inductive coupling due to power grid noise in signal delay modeling and simulations.
  • Keywords
    CMOS integrated circuits; aluminium; copper; integrated circuit interconnections; integrated circuit modelling; integrated circuit noise; 0.13 micron; 0.18 micron; Al; Al-based CMOS process; Al-based interconnect technology; Cu; Cu-based CMOS process; Cu-based interconnect technology; heuristic method; on-chip inductance; power grid noise; power supply network; signal delay modeling; signal delay simulation; signal nets; ultradeep submicron technology; CMOS process; CMOS technology; Clocks; Delay; Inductance; Network-on-a-chip; Power grids; Power supplies; Semiconductor device modeling; Signal analysis; On-chip inductance; power grid; very large scale integration (VLSI);
  • fLanguage
    English
  • Journal_Title
    Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1063-8210
  • Type

    jour

  • DOI
    10.1109/TVLSI.2004.842893
  • Filename
    1406040