DocumentCode
1248252
Title
Thermal Stress Birefringence in Buried-Core Waveguides With Over-Etch
Author
Dumais, Patrick
Author_Institution
Commun. Res. Centre Canada, Ottawa, ON, Canada
Volume
47
Issue
7
fYear
2011
fDate
7/1/2011 12:00:00 AM
Firstpage
989
Lastpage
996
Abstract
Thermal stress birefringence in buried-core waveguides is studied analytically and numerically to determine the role of cladding and core composition, core aspect ratio and over-etch depth. An analytical expression is derived for the over-etch depth required for stress birefringence compensation. Analytical expressions for the core stress are given for over-etched rectangular buried-core waveguides. The range of upper cladding thermal expansion coefficient over which stress birefringence compensation can be obtained through over-etching is established.
Keywords
birefringence; etching; optical waveguides; rectangular waveguides; thermal stresses; core aspect ratio; core stress; ore composition; over-etch depth; rectangular buried-core waveguides; stress birefringence compensation; thermal stress birefringence; upper cladding thermal expansion coefficient; Annealing; Optical waveguides; Silicon; Strain; Stress; Substrates; Birefringence; integrated optics; optical waveguides; stress;
fLanguage
English
Journal_Title
Quantum Electronics, IEEE Journal of
Publisher
ieee
ISSN
0018-9197
Type
jour
DOI
10.1109/JQE.2011.2151831
Filename
5896008
Link To Document