Title :
Electrochemical impedance spectroscopic study of encapsulated triple tracks test (TTT) circuits
Author :
Madani, Mahmoud M. ; Kodnani, Ramesh R. ; Granata, Richard D.
Author_Institution :
Zettlemoyer Center for Surface Studies, Lehigh Univ., Bethlehem, PA, USA
fDate :
3/1/1997 12:00:00 AM
Abstract :
Electrochemical impedance spectroscopy (EIS) is effective for studying the reliability of protective coatings on microelectronic packaging devices. Triple track test (TTT) circuits were evaluated as a function of exposure time at 121°C and 2 atm pressure. Specimens were deliberately contaminated by various chemicals and particles before coating. The impedance of some specimens decreased after the first 10 hours in the Pressure Cooker Test (PCT) while some lasted more than 150 hours in the PCT without an appreciable change in the impedance values. Impedance of the specimens changed appreciably due to water uptake in the epoxy coatings. The ionic contamination trapped under the coating caused faster failure in the TTT with respect to clean specimens. Water diffused to the polymer/gold interface causing a change in the dielectric properties of the specimen, shown as a shift in the EIS spectrum. This shift was observed in EIS spectra for most of the specimens which were exposed for more than 150 hours. The change suggests water that penetrated the coating made a conductive pathway to the interfacial region, a common cause of debonding between the metal (or ceramic) polymer interface. In one case (specimens contaminated by SiO2 particles) the shift was not observed-suggesting that SiO2 particles do not accelerate the adhesive failure at the metal (or ceramic)/polymer interface. The calculated saturated volume fraction of water at the metal (or ceramic)/polymer interface was 1.1±0.1
Keywords :
electric impedance measurement; encapsulation; integrated circuit packaging; polymers; protective coatings; reliability; spectroscopy; 121 C; 2 atm; Pressure Cooker Test; SiO2 particles; adhesive failure; capacitance; conductive pathway; dielectric properties; electrochemical impedance spectroscopy; encapsulated triple tracks test circuits; epoxy coatings; ionic contamination; microelectronic packaging devices; polymer/gold interface; protective coatings reliability; water diffusion; water uptake; Ceramics; Chemicals; Circuit testing; Coatings; Electrochemical impedance spectroscopy; Microelectronics; Packaging; Polymers; Protection; Water pollution;
Journal_Title :
Reliability, IEEE Transactions on