• DocumentCode
    1249571
  • Title

    Reliability assessment from fatigue micro-crack data

  • Author

    Wilson, Simon P. ; Taylor, David

  • Author_Institution
    Trinity Coll., Dublin, Ireland
  • Volume
    46
  • Issue
    2
  • fYear
    1997
  • fDate
    6/1/1997 12:00:00 AM
  • Firstpage
    165
  • Lastpage
    172
  • Abstract
    Micro-cracks are generally defined to be cracks less than 1 mm in length, which propagate under cyclic stresses until they grow large and cause failure in an item (e.g. component or structure). This paper proposes a method of using data on `fatigue micro-crack growth in a material´ to predict its reliability. It is increasingly important to model such cracks effectively, Their growth properties, which differ in several respects from larger cracks, are discussed. The paper develops a hierarchical model for the propagation of micro-cracks in a material. This stochastic model attempts to model the dependence of growth on local conditions, varying throughout the material, that causes variation in growth rates across the specimen. Given the model, data on micro-crack growth are used to compute posterior distributions of model parameters, from which a predictive distribution for reliability can be calculated. Computation of the posterior distributions is by Gibb´s sampling and kernel density estimation. The methodology is illustrated with two data sets, one simulated and the other from a cast-iron specimen. Some possibilities for further work are presented
  • Keywords
    Bayes methods; failure analysis; fatigue cracks; microcracks; reliability theory; stochastic processes; Bayes inference; Gibb´s sampling; cast-iron specimen; coalescence; component failure; crack growth properties; cyclic stresses; fatigue micro-crack growth; hierarchical model; kernel density estimation; posterior distributions; predictive distribution; reliability assessment; stochastic model; Conducting materials; Delay effects; Differential equations; Fatigue; Grain boundaries; Microstructure; Propagation delay; Stochastic processes; Stress;
  • fLanguage
    English
  • Journal_Title
    Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9529
  • Type

    jour

  • DOI
    10.1109/24.589943
  • Filename
    589943