• DocumentCode
    1249870
  • Title

    Phase Compensation of Cascaded Conductor-Backed CPW Periodic Cells

  • Author

    Ma, Kaixue ; Yeo, Kiat Seng ; Ma, Jian-Guo

  • Author_Institution
    Center for Integrated Circuits & Syst., Nanyang Technol. Univ., Singapore, Singapore
  • Volume
    2
  • Issue
    9
  • fYear
    2012
  • Firstpage
    1455
  • Lastpage
    1464
  • Abstract
    Several unit cells of conductor-backed coplanar waveguides with and without loading using thin-film ceramic technology are investigated. The frequency-dependent lumped equivalent circuit values of the cells are extracted from the full-wave electromagnetic analysis. Slow-wave periodic transmission lines and end-coupling bandpass filters (BPFs) are designed, fabricated, and measured. Size reductions of 23% and 27% for the loaded filters and several times increase of inverter values for the coupling inverters are achieved compared to that for the unloaded ones. A systematic design method by using cell cascading with compensation is proposed for the designs of the lines and filters. It is also demonstrated that “finite ground,” used in conductor-backed coplanar waveguides in the literature, is no longer suitable for the end-coupling BPFs due to the leakages. The leakages of finite ground deteriorate the stopband rejection of filters as much as up to 32 dB compared with that of “via ground”.
  • Keywords
    band-pass filters; ceramics; coplanar waveguides; equivalent circuits; transmission lines; cascaded conductor-backed CPW periodic cell; conductor-backed coplanar waveguide; coupling inverter; end-coupling bandpass filter; frequency-dependent lumped equivalent circuit; full-wave electromagnetic analysis; loaded filter; phase compensation; slow-wave periodic transmission line; stopband rejection; thin film ceramic technology; Coplanar waveguides; Couplings; Integrated circuit modeling; Inverters; Power transmission lines; Transmission line measurements; Conductor-backed coplanar waveguide; filter; periodic loading; slow-wave; transmission line;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2012.2205250
  • Filename
    6248177