DocumentCode :
125006
Title :
Study on complicated nonlinear phenomena in ultrasonic infrared thermography using circuit simulation method
Author :
Kai Zheng ; Jiang Zheng ; Shu-yi Zhang
Author_Institution :
Jiangsu Province Special Equip. Safety Supervision Inspection Inst., Nanjing, China
fYear :
2014
fDate :
20-23 June 2014
Firstpage :
19
Lastpage :
29
Abstract :
It has been shown that the complicated nonlinear vibration phenomena in mechanical workpieces under excitations of intense ultrasonic pulses increase greatly the detectability of defects (cracks). To study the nonlinear vibration phenomena of plates induced by the ultrasonic pulses, an electrical circuit model is proposed to simulate the mechanical vibro-impact motions between the transducer horn and plate sample based on the similar principles between electrical circuit systems and mechanical vibration systems. In the electronic circuit simulations of the nonlinear vibrations of plates, the analyses of the waveforms and frequency spectra are performed, which show that the harmonic, sub-harmonic, quasi-sub-harmonic and chaotic phenomena appear in the circuit model. The simulation calculation and data collection are simple and fast owing to algorithm of the Simulink. Therefore, the circuit simulation technique provides a useful approach to study and optimize ultrasonic infrared thermography for applying to NDE/T.
Keywords :
crack detection; infrared imaging; plates (structures); ultrasonic materials testing; vibrations; chaotic phenomena; circuit simulation method; cracks; electrical circuit model; electrical circuit systems; frequency spectra; harmonic phenomena; mechanical vibro-impact motions; nonlinear vibration phenomena; plate sample; quasisub-harmonic phenomena; sub-harmonic phenomena; transducer horn; ultrasonic infrared thermography; ultrasonic pulses; Acoustics; Analytical models; Harmonic analysis; Integrated circuit modeling; Mathematical model; Oscillators; Vibrations; Non-linear vibration phenomenon; electrical circuit modeling; intense ultrasonic excitation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nondestructive Evaluation/Testing (FENDT), 2014 IEEE Far East Forum on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4799-4731-7
Type :
conf
DOI :
10.1109/FENDT.2014.6928226
Filename :
6928226
Link To Document :
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