DocumentCode :
125040
Title :
Simulation study on quantitative evaluation of crack depth in crack inspection with eddy current stimulated thermography
Author :
Xiang-xiang Yi ; Jin-jing Zeng ; Sui-xian Yang
Author_Institution :
Sch. of Manuf. Sci. & Eng., Sichuan Univ., Chengdu, China
fYear :
2014
fDate :
20-23 June 2014
Firstpage :
190
Lastpage :
194
Abstract :
Quantitative evaluation of cracks is the critical issue of eddy current stimulated thermography. In this paper, numerical simulation study on the quantitative evaluation of cracks with eddy current stimulated thermography is introduced. The simulation works are conducted using COMSOL software. Sequential images are obtained during the heating and cooling periods of the test process. By processing the images with Matlab toolbox, the features of temperature distribution on the samples with specific artificial crack were extracted. A form of the temperature history of the centre point of the cracks have been constructed with the simulation results which is applied to quantitate the crack parameters by Lagrange interpolation algorithm with the temperature at the surface centre point of the crack obtained from the infrared image. The simulation results show that the crack depth can be calculated with the form of crack temperature history.
Keywords :
cooling; crack detection; eddy current testing; heat treatment; infrared imaging; interpolation; temperature distribution; COMSOL software; Lagrange interpolation algorithm; Matlab toolbox; cooling; crack depth; crack inspection; crack parameters; crack temperature; eddy current stimulated thermography; heating; infrared image; numerical simulation; quantitative crack evaluation; sequential images; specific artificial crack; surface centre point; temperature distribution; Conductivity; Cooling; Eddy currents; Heating; Interpolation; Surface cracks; Transient analysis; crack depth; eddy current stimulated thermography; simulation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nondestructive Evaluation/Testing (FENDT), 2014 IEEE Far East Forum on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4799-4731-7
Type :
conf
DOI :
10.1109/FENDT.2014.6928260
Filename :
6928260
Link To Document :
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