DocumentCode :
125042
Title :
Thermography spatial-transient-stage tensor model and materal property characterization
Author :
Bin Gao ; Aijun Yin ; Yizhe Wang ; Guiyun Tian ; Woo, Wai L. ; Hanxiao Liu
Author_Institution :
Sch. of Autom. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
fYear :
2014
fDate :
20-23 June 2014
Firstpage :
199
Lastpage :
203
Abstract :
Characterizing and tracking electrical conductivity, magnetic permeability and thermal conductivity in conductive material have promising potential for the detection and evaluation of material state undertaken by fatigue or residual stress. This letter proposes a spatial-transient-stage tensor mathematical model of eddy current pulsed thermography system and Tucker decomposition algorithm for characterizing and tracking the variation of properties. The links between mathematical and physical models have been discussed. The simulation experiments of tracking physic properties of steel material are investigated and verified. The estimation of normalized stage basis by using Tucker decomposition has shown high correlation relationships with different variation of physic properties in material.
Keywords :
eddy current testing; infrared imaging; normalising; pyrolysis; steel; Tucker decomposition algorithm; conductive material; eddy current pulsed thermography system; electrical conductivity; fatigue; magnetic permeability; material property characterization; material state detection; material state evaluation; normalized stage basis; physic properties; residual stress; spatial-transient-stage tensor mathematical model; steel material; thermal conductivity; thermography spatial-transient-stage tensor model; Conductivity; Eddy currents; Heating; Materials; Mathematical model; Tensile stress; Transient analysis; Material properties variation tracking; Non-destructive testing and evaluation; Thermal tensor mathematical model; Tucker decomposition;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nondestructive Evaluation/Testing (FENDT), 2014 IEEE Far East Forum on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4799-4731-7
Type :
conf
DOI :
10.1109/FENDT.2014.6928262
Filename :
6928262
Link To Document :
بازگشت