Thermography spatial-transient-stage tensor model and materal property characterization

Author

Bin Gao ; Aijun Yin ; Yizhe Wang ; Guiyun Tian ; Woo, Wai L. ; Hanxiao Liu

Author_Institution

Sch. of Autom. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu, China

fYear

2014

fDate

20-23 June 2014

Firstpage

199

Lastpage

203

Abstract

Characterizing and tracking electrical conductivity, magnetic permeability and thermal conductivity in conductive material have promising potential for the detection and evaluation of material state undertaken by fatigue or residual stress. This letter proposes a spatial-transient-stage tensor mathematical model of eddy current pulsed thermography system and Tucker decomposition algorithm for characterizing and tracking the variation of properties. The links between mathematical and physical models have been discussed. The simulation experiments of tracking physic properties of steel material are investigated and verified. The estimation of normalized stage basis by using Tucker decomposition has shown high correlation relationships with different variation of physic properties in material.

Keywords

eddy current testing; infrared imaging; normalising; pyrolysis; steel; Tucker decomposition algorithm; conductive material; eddy current pulsed thermography system; electrical conductivity; fatigue; magnetic permeability; material property characterization; material state detection; material state evaluation; normalized stage basis; physic properties; residual stress; spatial-transient-stage tensor mathematical model; steel material; thermal conductivity; thermography spatial-transient-stage tensor model; Conductivity; Eddy currents; Heating; Materials; Mathematical model; Tensile stress; Transient analysis; Material properties variation tracking; Non-destructive testing and evaluation; Thermal tensor mathematical model; Tucker decomposition;

fLanguage

English

Publisher

ieee

Conference_Titel

Nondestructive Evaluation/Testing (FENDT), 2014 IEEE Far East Forum on

Conference_Location

Chengdu

Print_ISBN

978-1-4799-4731-7

Type

conf

DOI

10.1109/FENDT.2014.6928262

Filename

6928262