Developing infrastructure to mass-produce MEMS

Author

Markus, Karen W.

Author_Institution

MEMS Technol. Applications Center, MCNC, Research Triangle Park, NC, USA

Volume

4

Issue

1

fYear

1997

Firstpage

49

Lastpage

54

Abstract

Though microelectromechanical systems are often made from silicon, the existing semiconductor technology base faces numerous challenges to meet the special requirements of fabricating MEMS devices. To realize economies of scale, seven aspects of MEMS manufacturing infrastructure must be improved: computer aided design and simulation; lithography; etching; parametric testing; functional testing; packaging; and capital equipment

Keywords

circuit analysis computing; etching; integrated circuit testing; lithography; micromechanical devices; semiconductor device manufacture; MEMS device fabrication; MEMS manufacturing infrastructure; MEMS mass production; capital equipment; computer aided design; etching; functional testing; lithography; microelectromechanical systems; packaging; parametric testing; semiconductor technology base; simulation; Computational modeling; Computer aided manufacturing; Economies of scale; Microelectromechanical devices; Microelectromechanical systems; Micromechanical devices; Semiconductor device manufacture; Silicon; Testing; Virtual manufacturing;

fLanguage

English

Journal_Title

Computational Science & Engineering, IEEE

Publisher

ieee

ISSN

1070-9924

Type

jour

DOI

10.1109/99.590857

Filename

590857