DocumentCode
1251428
Title
Test structure to investigate the series resistance components of source/drain structure
Author
Biesemans, S. ; Kubicek, S. ; De Meyer, K.
Author_Institution
IMEC, Leuven, Belgium
Volume
18
Issue
10
fYear
1997
Firstpage
477
Lastpage
479
Abstract
The source and drain (S/D) structure is a key element in scaling down the MOSFET for low-power applications below 0.25-μm dimensions. Here, we report on a simple test structure and show how more detailed information on the parasitic series resistance components of deep submicron devices can be obtained. Specifically, the dependence of the different resistance components on the process parameters like dose and energy of implantation, temperature treatment, spacer width, and silicide formation can be investigated with high accuracy.
Keywords
MOSFET; contact resistance; electric resistance measurement; ion implantation; semiconductor device metallisation; semiconductor device testing; 0.06 to 0.33 mum; CoSi/sub 2/-Si; MOSFET scaling; deep submicron devices; extension diffusion resistance; implantation dose; implantation energy; low-power applications; resistor length; series resistance components; silicide formation; silicide/Si contact resistance; source/drain structure; spacer width; temperature treatment; test structure; CMOS technology; Contact resistance; Electrical resistance measurement; MOSFET circuits; Resistors; Silicides; Space technology; Temperature dependence; Testing; Very large scale integration;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/55.624920
Filename
624920
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