• DocumentCode
    1251428
  • Title

    Test structure to investigate the series resistance components of source/drain structure

  • Author

    Biesemans, S. ; Kubicek, S. ; De Meyer, K.

  • Author_Institution
    IMEC, Leuven, Belgium
  • Volume
    18
  • Issue
    10
  • fYear
    1997
  • Firstpage
    477
  • Lastpage
    479
  • Abstract
    The source and drain (S/D) structure is a key element in scaling down the MOSFET for low-power applications below 0.25-μm dimensions. Here, we report on a simple test structure and show how more detailed information on the parasitic series resistance components of deep submicron devices can be obtained. Specifically, the dependence of the different resistance components on the process parameters like dose and energy of implantation, temperature treatment, spacer width, and silicide formation can be investigated with high accuracy.
  • Keywords
    MOSFET; contact resistance; electric resistance measurement; ion implantation; semiconductor device metallisation; semiconductor device testing; 0.06 to 0.33 mum; CoSi/sub 2/-Si; MOSFET scaling; deep submicron devices; extension diffusion resistance; implantation dose; implantation energy; low-power applications; resistor length; series resistance components; silicide formation; silicide/Si contact resistance; source/drain structure; spacer width; temperature treatment; test structure; CMOS technology; Contact resistance; Electrical resistance measurement; MOSFET circuits; Resistors; Silicides; Space technology; Temperature dependence; Testing; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.624920
  • Filename
    624920