DocumentCode
1251463
Title
Whisker Formation Concepts—The End Game
Author
Galyon, George
Author_Institution
Syst. & Technol. Div., IBM Corp., Armonk, NY, USA
Volume
1
Issue
7
fYear
2011
fDate
7/1/2011 12:00:00 AM
Firstpage
1098
Lastpage
1109
Abstract
This paper elaborates on previously published theories dealing with tin whisker formation mechanisms and introduces some new concepts to build a theory that is both fundamentally sound and consistent with experimental observations made to date. Central to the proposed hypothesis is the unique chevron (or V-shaped) whisker grain that forms within the as-deposited tin film grain structure. This treatment also deals with some ancillary tin film observations such as the intermetallic “pedestal” structures formed by temperature cycling and the “subsidence” structures often associated with tin whisker formation.
Keywords
grain boundaries; metallic thin films; tin; whiskers (crystal); Sn; as-deposited film grain structure; intermetallic pedestal structure; subsidence structure; temperature cycling; whisker formation concept; Copper; Grain boundaries; Strain; Stress; Substrates; Surface morphology; Tin; Back stresses; grain boundary slip; grain subsidence; grain-boundary order; inter-metallic pedestals; long-range diffusion; surface diffusion; tin whiskers; whisker grains; whisker kinking;
fLanguage
English
Journal_Title
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
2156-3950
Type
jour
DOI
10.1109/TCPMT.2010.2103319
Filename
5910364
Link To Document