• DocumentCode
    1251463
  • Title

    Whisker Formation Concepts—The End Game

  • Author

    Galyon, George

  • Author_Institution
    Syst. & Technol. Div., IBM Corp., Armonk, NY, USA
  • Volume
    1
  • Issue
    7
  • fYear
    2011
  • fDate
    7/1/2011 12:00:00 AM
  • Firstpage
    1098
  • Lastpage
    1109
  • Abstract
    This paper elaborates on previously published theories dealing with tin whisker formation mechanisms and introduces some new concepts to build a theory that is both fundamentally sound and consistent with experimental observations made to date. Central to the proposed hypothesis is the unique chevron (or V-shaped) whisker grain that forms within the as-deposited tin film grain structure. This treatment also deals with some ancillary tin film observations such as the intermetallic “pedestal” structures formed by temperature cycling and the “subsidence” structures often associated with tin whisker formation.
  • Keywords
    grain boundaries; metallic thin films; tin; whiskers (crystal); Sn; as-deposited film grain structure; intermetallic pedestal structure; subsidence structure; temperature cycling; whisker formation concept; Copper; Grain boundaries; Strain; Stress; Substrates; Surface morphology; Tin; Back stresses; grain boundary slip; grain subsidence; grain-boundary order; inter-metallic pedestals; long-range diffusion; surface diffusion; tin whiskers; whisker grains; whisker kinking;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2010.2103319
  • Filename
    5910364