Title :
MBPCA application for fault detection in NMOS fabrication
Author :
Lachman-Shalem, Sivan ; Haimovitch, Nir ; Shauly, Eitan N. ; Lewin, Daniel R.
Author_Institution :
Dept. of Chem. Eng., Technion-Israel Inst. of Technol., Haifa, Israel
fDate :
2/1/2002 12:00:00 AM
Abstract :
This paper describes the application of model-based principal component analysis (MBPCA) to the identification and isolation of faults in NMOS manufacture. In MBPCA, multivariate statistics are applied to the analysis of the portion of the data variance that is unexplained by models based on material and energy balances carried out on the unit operations used in manufacture. It is demonstrated that the failure detection and isolation performance achievable using the model-based procedure exceeds that of commonly used univariate SPC or conventional PCA approaches
Keywords :
MOS integrated circuits; fault diagnosis; integrated circuit manufacture; principal component analysis; MBPCA application; NMOS fabrication; data variance; fault detection; fault identification; fault isolation; model-based principal component analysis; model-based procedure; multivariate statistics; unit operations; Fabrication; Fault detection; Fault diagnosis; MOS devices; Monitoring; Network-on-a-chip; Ovens; Principal component analysis; Statistical analysis; Virtual manufacturing;
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
