DocumentCode :
1253044
Title :
Placement for reliability and routability of convectively cooled PWBs
Author :
Osterman, Michael D. ; Pecht, Michael
Author_Institution :
CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA
Volume :
9
Issue :
7
fYear :
1990
fDate :
7/1/1990 12:00:00 AM
Firstpage :
734
Lastpage :
744
Abstract :
A coupled reliability and routability placement procedure for arranging electronic components on a convectively cooled two-dimensional workspace, printed wiring boards (PWBs), is developed. The objective is to improve the total reliability of all the components on the PWB by minimizing the sum of the individual component failure rates (i.e. minimizing the total failure rate) while also minimizing the total wire length. The placement procedures for reliability are based on a priority metric derived from a temperature-dependent failure rate equation and heat transfer equations for a single row of convectively cooled components. After a brief discussion of the force-directed methodology in terms of placement for routability and its relation to placement for reliability, a theory of placement for reliability on convectively cooled PWBs is discussed, and placement procedures for reliability along a row and an entire PWB are presented. A force-directed placement technique for reliability is developed, and the coupled placement procedure for reliability and routability is introduced. Examples of each procedure are presented and discussed
Keywords :
circuit layout; circuit reliability; failure analysis; printed circuit design; component failure rates; convectively cooled PWBs; coupled placement procedure; electronic components; heat transfer equations; placement procedure; priority metric; reliability; routability; row; temperature-dependent failure rate equation; total wire length; Acceleration; Cooling; Electronic components; Equations; Heat transfer; Kelvin; Minimization; Reliability theory; Temperature; Thermal resistance;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/43.55206
Filename :
55206
Link To Document :
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