DocumentCode
1253662
Title
Method for modelling substrate coupling in large chip designs
Author
Singh, Rajdeep ; Sali, S.
Author_Institution
Dept. of Electr. & Electron. Eng., Newcastle upon Tyne Univ.
Volume
33
Issue
11
fYear
1997
fDate
5/22/1997 12:00:00 AM
Firstpage
952
Lastpage
954
Abstract
The authors present a novel method for modelling substrate noise in large mixed-signal SPICE designs. The approach is very efficient and can be applied to large designs with many digital blocks. An example circuit, which cannot be efficiently analysed with any current method, is used to demonstrate this new method
Keywords
SPICE; integrated circuit design; integrated circuit modelling; integrated circuit noise; mixed analogue-digital integrated circuits; substrates; SPICE model; large chip design; mixed-signal circuit; substrate coupling; substrate noise;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:19970639
Filename
591561
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