Title :
Foreword SEMITHERM XIII
Author :
Seri Lee ; Manno, Vincent P. ; Simons, R.E.
Keywords :
Electronic packaging thermal management; Heat sinks; Heat transfer; Libraries; Microchannel; Multichip modules; Numerical models; Thermal management; Thermal management of electronics; Water heating;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
DOI :
10.1109/TCPMA.1997.650926
