DocumentCode :
1253752
Title :
Compact air-cooled heat sinks for power packages
Author :
Aranyosi, Attila ; Bolle, Léon M R ; Buyse, Hervé A.
Author_Institution :
Miskolc Univ., Hungary
Volume :
20
Issue :
4
fYear :
1997
fDate :
12/1/1997 12:00:00 AM
Firstpage :
442
Lastpage :
451
Abstract :
The main findings of a theoretical and experimental work carried out in the development of compact air-cooled heat sinks tailored for spot-cooling of power packages are presented. After formulating the particular cooling task, the thermal issues and practical constraints of a compact heat exchanger design are matched to yield three structures, i.e., microchannel, woven wire screen and porous metal fiber, to be viable candidates. A simplified analytical model is developed to allow performance analyses and optimizations of microchannel and woven wire screen heat sinks operated in impingement mode. Based on the simulation results, five novel heat sinks are fabricated and tested. An experimental setup is built to investigate the effects of heat sink structure, mass-flow rate of air, power dissipation and mounting conditions on heat sink performance. In the measurements the source-gate voltage of the selected MOSFET is used as temperature sensitive electrical parameter (TSEP) to obtain the peak junction temperature. Dissipated base plate and volumetric heat fluxes of 15 W/cm2 and 5 W/cm3 are achieved, along with reasonable pressure and pumping power requirements as well as accompanying acoustic noise. Obtained results yield a fivefold enhancement in heat removal capability compared to traditional forced air-cooling schemes
Keywords :
cooling; heat sinks; power MOSFET; semiconductor device packaging; MOSFET; acoustic noise; analytical model; base plate; compact air-cooled heat sink; heat exchanger; jet impingement; mass flow rate; microchannel; mounting; peak junction temperature; porous metal fiber; power dissipation; power package; simulation; source-gate voltage; spot cooling; temperature sensitive electrical parameter; volumetric heat flux; woven wire screen; Analytical models; Cooling; Heat sinks; Microchannel; Optical fiber testing; Packaging; Performance analysis; Power dissipation; Temperature sensors; Wire;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9886
Type :
jour
DOI :
10.1109/95.650933
Filename :
650933
Link To Document :
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