Study of delaminated plastic packages by high temperature Moire and finite element method

Author

Liu, Sheng ; Zhu, Jiansen ; Zou, Daqing ; Benson, Jim

Author_Institution

Dept. of Mech. Eng., Wayne State Univ., Detroit, MI, USA

Volume

20

Issue

4

fYear

1997

fDate

12/1/1997 12:00:00 AM

Firstpage

505

Lastpage

512

Abstract

In the current study, 1200 l/mm gratings are replicated at elevated temperatures onto the cross sections of two delaminated plastic packages: a thin quad flatpack plastic package (TQFPP) and a power small outline plastic package (PSOPP). The specimens are measured at room temperature for thermal deformation induced by cooling process. The finite element models are used to simulate the cooling process and the results are compared with the Moire interferometry results. The finite element models with different delaminations between die and die attach are used to simulate the fringe patterns obtained from Moire interferometry. It was found that the delamination size can be estimated by the combination of Moire technique and finite element method. The finite element model, once verified, can then be used in making cost effective decisions in plastic packaging design and processing

Keywords

cooling; delamination; finite element analysis; integrated circuit design; integrated circuit packaging; moire fringes; plastic packaging; Moire interferometry results; cooling process; delaminated plastic packages; finite element method; fringe patterns; high temperature Moire method; packaging design; power small outline plastic package; thermal deformation; thin quad flatpack plastic package; Cooling; Costs; Delamination; Finite element methods; Gratings; Interferometry; Microassembly; Plastic packaging; Process design; Temperature measurement;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on

Publisher

ieee

ISSN

1070-9886

Type

jour

DOI

10.1109/95.650941

Filename

650941