DocumentCode
1253837
Title
On the effect of nonlinear boundary conditions for heat conduction in diamond heat spreaders with temperature-dependent thermal conductivity
Author
Hui, Ping ; Tan, H.S.
Author_Institution
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
Volume
20
Issue
4
fYear
1997
fDate
12/1/1997 12:00:00 AM
Firstpage
537
Lastpage
540
Abstract
For steady-state heat conduction in diamond heat spreaders with temperature-dependent thermal conductivity, we examine the valid range of the commonly used approximate solution against a rigorous solution which we have recently formulated. The basic difference between our work and the approximate solution lies in the boundary condition (bc) of the transformed temperature over the spreader-sink interface-we use a nonlinear be whereas the bc in the approximate solution has been assumed to be linear. We point out that the valid range of the approximate solution is determined by the temperature difference above the ambient over the interface. The discrepancy between the two solutions becomes severe (>10%) for devices of radius around 50 μm involving high power dissipation (>20 W)
Keywords
cooling; diamond; heat conduction; heat sinks; packaging; thermal conductivity; 20 W; 50 micron; C; diamond heat spreader; nonlinear boundary conditions; power dissipation; spreader-sink interface; steady-state heat conduction; temperature-dependent thermal conductivity; Boundary conditions; Boundary value problems; Electromagnetic heating; Electronic packaging thermal management; Nonlinear equations; Semiconductor diodes; Tellurium; Temperature distribution; Thermal conductivity; Thermal resistance;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher
ieee
ISSN
1070-9886
Type
jour
DOI
10.1109/95.650945
Filename
650945
Link To Document