• DocumentCode
    1253837
  • Title

    On the effect of nonlinear boundary conditions for heat conduction in diamond heat spreaders with temperature-dependent thermal conductivity

  • Author

    Hui, Ping ; Tan, H.S.

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
  • Volume
    20
  • Issue
    4
  • fYear
    1997
  • fDate
    12/1/1997 12:00:00 AM
  • Firstpage
    537
  • Lastpage
    540
  • Abstract
    For steady-state heat conduction in diamond heat spreaders with temperature-dependent thermal conductivity, we examine the valid range of the commonly used approximate solution against a rigorous solution which we have recently formulated. The basic difference between our work and the approximate solution lies in the boundary condition (bc) of the transformed temperature over the spreader-sink interface-we use a nonlinear be whereas the bc in the approximate solution has been assumed to be linear. We point out that the valid range of the approximate solution is determined by the temperature difference above the ambient over the interface. The discrepancy between the two solutions becomes severe (>10%) for devices of radius around 50 μm involving high power dissipation (>20 W)
  • Keywords
    cooling; diamond; heat conduction; heat sinks; packaging; thermal conductivity; 20 W; 50 micron; C; diamond heat spreader; nonlinear boundary conditions; power dissipation; spreader-sink interface; steady-state heat conduction; temperature-dependent thermal conductivity; Boundary conditions; Boundary value problems; Electromagnetic heating; Electronic packaging thermal management; Nonlinear equations; Semiconductor diodes; Tellurium; Temperature distribution; Thermal conductivity; Thermal resistance;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9886
  • Type

    jour

  • DOI
    10.1109/95.650945
  • Filename
    650945