• DocumentCode
    1253914
  • Title

    Influence of physical/chemical characteristics of organic vapors and gas mixtures on their contact compatibility

  • Author

    Koidl, Hermann P. ; Rieder, Werner F. ; Salzmann, Quido R.

  • Author_Institution
    Inst. of Switching Devices & High Voltage Technol., Wien Univ., Austria
  • Volume
    22
  • Issue
    3
  • fYear
    1999
  • fDate
    9/1/1999 12:00:00 AM
  • Firstpage
    439
  • Lastpage
    445
  • Abstract
    The formation of carbon on the contact surfaces of commercial relays by thermal decomposition of organic vapors emanating from various organic materials may cause an undesirable increase of the contact resistance in the range of several Ohms. Previous investigations revealed that the contact compatibility of an organic vapor in combination with a certain contact material depends mainly on its chemical structure. There are additional correlations between the contact compatibility on the one hand and a few parameters of the vapors like volatility, the basic structure type of the molecule (e.g., aromatic or aliphatic, length of the carbon chain), certain active groups on the other hand. The contact compatibility values of a few mixtures of organic vapors investigated corresponded to those of their individual components. Humidity and oxygen concentration of the atmosphere influenced the phenomenon effectively
  • Keywords
    adsorption; chemisorption; contact resistance; electrical contacts; gas mixtures; humidity; organic compounds; relays; reliability; surface contamination; carbon formation; chemical characteristics; commercial relays; contact compatibility; contact material; contact resistance; contact surfaces; gas mixtures; humidity; organic vapors; oxygen concentration; physical characteristics; thermal decomposition; volatility; Contact resistance; Materials testing; Organic chemicals; Organic materials; Relays; Surface contamination; Surface resistance; Switches; Temperature; Voltage;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/6144.796548
  • Filename
    796548