Investigation of electronic assembly design alternatives through production modeling of life cycle impacts, costs, and yield

Author

Stuart, Julie Ann ; Turbini, Laura J. ; Ammons, Jane Chumley

Author_Institution

Dept. of Ind. Welding & Syst. Eng., Ohio State Univ., Columbus, OH, USA

Volume

20

Issue

4

fYear

1997

fDate

10/1/1997 12:00:00 AM

Firstpage

317

Lastpage

326

Abstract

Environmental legislation, technological advances and increasingly competitive global markets have led to a number of different product and process design choices for electronics assemblies. Decision tools to aid in the selection of a product and process design have been limited to qualitative methodologies. In addition, trade-offs between environmental impacts, yield, and reliability have not been analyzed. In this paper, electronic assembly product and process design alternatives are investigated using a quantitative methodology with life cycle considerations for environmental impacts. These impacts include energy usage, material consumption, waste generation, process yield, and product reliability

Keywords

assembling; environmental factors; integrated circuit reliability; integrated circuit yield; legislation; costs; electronic assembly design alternatives; energy usage; environmental legislation; global markets; life cycle considerations; life cycle impacts; material consumption; process design; process yield; production modeling; qualitative methodologies; reliability; waste generation; Assembly; Consumer electronics; Costs; Electrostatic discharge; Legislation; Manufacturing processes; Process design; Production; Waste materials; Wiring;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on

Publisher

ieee

ISSN

1083-4400

Type

jour

DOI

10.1109/3476.650964

Filename

650964