• DocumentCode
    1253940
  • Title

    The preparation and the properties of microcrystalline and nanocrystalline CuCr contact materials

  • Author

    Wang, Yaping ; Ding, Bingjun

  • Author_Institution
    Inst. of Metal Res., Acad. Sinica, Beijing, China
  • Volume
    22
  • Issue
    3
  • fYear
    1999
  • fDate
    9/1/1999 12:00:00 AM
  • Firstpage
    467
  • Lastpage
    472
  • Abstract
    The microcrystalline and nanocrystalline CuCr alloys prepared by high-energy ball milling and hot pressing were investigated in this paper. The experimental results show that the nanocrystalline Cu-Cr alloy powders are obtained by high energy ball milling, and the milled powders appear flaked or equiaxed morphology with or without liquid medium addition. The grain size of near fully dense alloys consolidated at 850 and 1200 K from milled powders is less than 100 nm and about 2-3 μm, respectively. The ability to withstand high voltage of the nanocrystalline CuCr materials in vacuum is much higher than that of microcrystalline materials. The breakdown first takes place on the Cu-rich phase in the microcrystalline CuCr materials. For nanocrystalline CuCr materials, the breakdown exhibits a diffusional feature, in which the arc can move to the whole contact surface in a breakdown
  • Keywords
    chromium alloys; circuit-breaking arcs; copper alloys; electric breakdown; electrical contacts; grain size; hot pressing; nanostructured materials; powder metallurgy; vacuum interrupters; 100 nm; 2 to 3 micron; 850 to 1200 K; Cu-rich phase; CuCr; CuCr alloys; CuCr contact materials; arcing; grain size; high-energy ball milling; hot pressing; material preparation; microcrystalline contact material; milled powders; nanocrystalline contact material; Ball milling; Chromium; Electric breakdown; Grain size; Laboratories; Nanostructured materials; Powders; Pressing; Voltage; X-ray diffraction;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/6144.796552
  • Filename
    796552