Title :
Fault arcs effects in cable bundles for space applications in vacuum
Author :
Hanson, Josef ; Koenig, Dieter
Author_Institution :
High Voltage Lab., Darmstadt Univ. of Technol., Germany
fDate :
8/1/1997 12:00:00 AM
Abstract :
A multitude of `arc tracking´ tests on cables for space applications has been performed to improve the basic understanding of the phenomena responsible for the fault arc behavior. The damage in a cable bundle develops in a complex system consisting of metallic conductors, insulation materials and arc plasma. Considering the degradation effects, vacuum as one of the applied test parameters, has turned out to be an important test environment. The investigations are based on a new test method, developed to assess arc tracking properties of cables for space applications. Tests were conducted with different insulation materials at cables with different AWG at 125 V dc and nominal currents. The tests were focused on the vacuum environment, using air only for the purpose of comparison. For some cable types, vacuum has turned out to be a worst-case environmental condition with respect to fault arc effects, such as the conductor burn-off, degradation of the insulation of adjacent cables and the extension of the fault arc. This paper presents these worst case experiments in detail
Keywords :
environmental degradation; environmental testing; fault currents; insulation testing; power cable insulation; power cable testing; space vehicle electronics; vacuum arcs; 125 V; AWG; arc tracking tests; cable bundles; cable insulation degradation; conductor burn-off; degradation effects; fault arcs effects; hybrid-insulated cables; insulation materials; space applications; spacecraft wiring system; test environment; vacuum environment; worst-case environmental condition; Arc discharges; Cable insulation; Conducting materials; Degradation; Extraterrestrial phenomena; Inorganic materials; Insulation life; Performance evaluation; Plasma applications; Testing;
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on