Substrate impact on the thermal performance of tape automated bonding components

The results of thermally characterizing a 160-I/O (input/output) tape automated bonding (TAB) device are reported. A finite-element technique is used to understand and model the thermal processes of the TAB. A three-dimensional (3-D) computer model is developed and validated against experimental data obtained in a natural convection environment. The 3-D model´s results indicate that the thermal processes associated with the TAB are not 2-D in nature. A substantial temperature variation is present across much of the device. Several carriers are modeled with the TAB device to determine their thermal effect on the device´s thermal characteristics. Reducing the card´s cross-section from a multilayer printed circuit board (PCB) to a board with no internal planes substantially impacts the power dissipation capabilities of the component. The use of a molded rather than an FR4 material in the card has a negligible effect on the thermal characteristics of the attached device due to their similar thermal conductivity