Title :
A review of thermal enhancement techniques for electronic systems
Author :
Fletcher, Leroy S.
Author_Institution :
Dept. of Mech. Eng., Texas A&M Univ., College Station, TX, USA
fDate :
12/1/1990 12:00:00 AM
Abstract :
Thermal enhancement techniques for maximizing the thermal contact conductance including the use of greases, metallic foils, and screens, composite materials and cements, and surface treatments are reviewed. The relative merits of the various enhancement techniques are summarized and comparisons are made for selected thermal enhancement materials. The results should prove useful in selecting thermal enhancement materials for use in improving the thermal performance of specific electronic systems
Keywords :
heat sinks; packaging; surface treatment; thermal conductivity of solids; cements; composite materials; greases; metallic foils; packaging; screens; surface treatments; thermal conductivity; thermal contact conductance; thermal enhancement; Bonding; Building materials; Conducting materials; Control systems; Electronic components; Electronic packaging thermal management; Heat transfer; Surface treatment; Thermal conductivity; Thermal resistance;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
