Title :
High performance air cooled heat sinks for integrated circuits
Author :
Hilbert, Claude ; Sommerfeldt, Scott ; Gupta, Omkarnath ; Herrell, Dennis J.
Author_Institution :
Microelectron. & Comput. Technol. Corp., Austin, TX, USA
fDate :
12/1/1990 12:00:00 AM
Abstract :
A simple, compact, high-performance air cooling technology is described that combines laminar flow with certain heat-sink designs to achieve a cooling performance of <2°C/W/cm2 at 2 ft 3/min. It has the capability to remove in excess of 600 W from a multichip module (25 chips at 25 W and 16% chip-to-substrate coverage) with a quiet 10-W tubeaxial fan. The volume of the complete module including the plenum and the fan is only about 1 l. The chips are held to maximum temperature rise of 55°C. Even higher cooling performance at greater chip-to-substrate coverage is shown to be possible with larger air movers. This technology extends the applicability of air cooling to the power levels of complex liquid-cooled modules
Keywords :
cooling; heat sinks; integrated circuit technology; modules; 10 W; 25 W; 55 degC; 600 W; air cooled heat sinks; chip-to-substrate coverage; complete module; integrated circuits; laminar flow; multichip module; tubeaxial fan; Heat sinks; Heat transfer; Integrated circuit technology; Liquid cooling; Microchannel; Power dissipation; Semiconductor device packaging; Thermal conductivity; Thermal management; Trigeneration;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
