DocumentCode
1255430
Title
Coupled noise and its effects on modern packaging technology
Author
Russ, Samuel H. ; Alford, Cecil O.
Author_Institution
Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume
13
Issue
4
fYear
1990
fDate
12/1/1990 12:00:00 AM
Firstpage
1074
Lastpage
1082
Abstract
An overview is presented of the causes of coupled noise and ways that coupled noise affects modern packaging technology. Two major types of coupled noise, crosstalk and switching noise, are discussed, with emphasis on physical causes and means of reducing both types. Major types of multiple-die hybrid and conventional packaging are described, and a case is made for the need for three-dimensional packaging. An example is presented of a low-noise packaging concept for 3-D integration
Keywords
crosstalk; integrated circuit technology; noise; packaging; reviews; 3D integration; 3D packaging; coupled noise; crosstalk; multiple-die hybrid packaging; overview; packaging technology; switching noise; Circuit noise; Clocks; Conductors; Crosstalk; Driver circuits; Fabrication; Integrated circuit noise; Integrated circuit packaging; Noise reduction; Voltage;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/33.62551
Filename
62551
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