Title :
Coupled noise and its effects on modern packaging technology
Author :
Russ, Samuel H. ; Alford, Cecil O.
Author_Institution :
Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fDate :
12/1/1990 12:00:00 AM
Abstract :
An overview is presented of the causes of coupled noise and ways that coupled noise affects modern packaging technology. Two major types of coupled noise, crosstalk and switching noise, are discussed, with emphasis on physical causes and means of reducing both types. Major types of multiple-die hybrid and conventional packaging are described, and a case is made for the need for three-dimensional packaging. An example is presented of a low-noise packaging concept for 3-D integration
Keywords :
crosstalk; integrated circuit technology; noise; packaging; reviews; 3D integration; 3D packaging; coupled noise; crosstalk; multiple-die hybrid packaging; overview; packaging technology; switching noise; Circuit noise; Clocks; Conductors; Crosstalk; Driver circuits; Fabrication; Integrated circuit noise; Integrated circuit packaging; Noise reduction; Voltage;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
