Title :
Packaging technology for a low temperature astrometric sensor array
Author :
Chen, Cherh-Lin ; Johnson, R. Wayne ; Jaeger, Richard C. ; Cornelius, Michael B. ; Foster, Winfred A.
Author_Institution :
Dept. of Electr. Eng., Auburn Univ., AL, USA
fDate :
12/1/1990 12:00:00 AM
Abstract :
An advanced astrometric sensor array (AASA) of charge-coupled device (CCD) chips was constructed using thin-film hybrid multichip packaging technology for operation at -140°C. A series of AASA prototypes were fabricated with various epoxies, circuitry layouts, and substrate thicknesses in order to determine materials, fabrication processes, and structures suitable for construction of the AASA. A silicon template was fabricated by anisotropic etching and used to align the sensors. The AASA samples were evaluated by thermal cycling (27-138°C) and die shear tests. Computer modeling was used for thermal stress analysis of the mechanical behavior of the AASA as a function of temperature. The coupled noise between long parallel lines (1.5 cm) on the AASA was investigated by circuit simulation and experimental measurements. The experimental and modeling results are presented
Keywords :
CCD image sensors; integrated circuit technology; low-temperature techniques; packaging; stress analysis; thermal stresses; -140 degC; 27 to 138 degC; CCD chips; Si template; anisotropic etching; charge-coupled device; circuit simulation; circuitry layouts; computer modelling; coupled noise; die shear tests; epoxies; fabrication processes; low temperature astrometric sensor array; sensor alignment; substrate thicknesses; thermal cycling; thermal stress analysis; thin-film hybrid multichip packaging technology; Charge coupled devices; Packaging; Prototypes; Sensor arrays; Substrates; Temperature sensors; Thermal stresses; Thin film circuits; Thin film devices; Thin film sensors;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
