Effect of temperature on isothermal fatigue of solders

Author

Vaynman, Semyon

Author_Institution

Basic Ind. Res. Lab., Northwestern Univ., Evanston, IL, USA

Volume

13

Issue

4

fYear

1990

fDate

12/1/1990 12:00:00 AM

Firstpage

909

Lastpage

913

Abstract

The effect of temperature on isothermal fatigue of low-tin lead-based and lead-tin eutectic solders is discussed. The study was conducted at low strain ranges (0.3-1.0% total strain) in tests without and with hold time in the cycle. While temperature has almost no effect on the fatigue life of eutectic solder, the fatigue life of low-tin lead-based solder is a complex function of temperature. Extrapolation of fatigue data for this older was only possible in a 25-80°C temperature range, using values of apparent activation energy for 25 to 45 kJ/mole depending on strain range, strain rate, and presence of hold time in the cycle. Variation in the values of activation energy was found to be associated with different failure modes under various testing conditions. Higher activation energy for the fatigue of low-tin lead-based solder was associated with mixed transgranular-intergranular failure. Failure in grain boundaries was characterized by lower values of activation energy

Keywords

environmental testing; fatigue testing; lead alloys; materials testing; soldering; tin alloys; 25 to 80 C; Pb based solders; Pb-Sn solders; activation energy; effect of temperature; eutectic solders; failure modes; fatigue life; grain boundaries failure; hold time; isothermal fatigue of solders; low strain ranges; mixed transgranular-intergranular failure; strain range; strain rate; Capacitive sensors; Electronic packaging thermal management; Fatigue; Isothermal processes; Joining materials; Lead; Temperature distribution; Tensile strain; Tensile stress; Testing;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.62555

Filename

62555