Advanced testing and prognostics of ball grid array components with a stand-alone monitor IC

Author

Bhatia, Anuj ; Hofmeister, James P. ; Judkins, Justin ; Goodman, Doug

Volume

13

Issue

4

fYear

2010

fDate

8/1/2010 12:00:00 AM

Firstpage

42

Lastpage

47

Abstract

In this paper, we introduced a new solder-joint fault sensor, SJ Monitor. We gave a brief overview of the mechanics-of-failure, the intermittent behavior of fractured solder bumps, the state-of-the-art in fault detection, details of the SJ Monitor and discussed intermittency mitigation. The primary contributor to fatigue damage of solder joints is thermomechanical stresses. Solder-joint fatigue damage can result in fractures that cause intermittent instances of high-resistance spikes that are hard to diagnose.

Keywords

ball grid arrays; digital integrated circuits; fault diagnosis; solders; thermomechanical treatment; SJ monitor; ball grid array component; fault detection; high-resistance spike; mechanics of failure; solder bump; solder joint fault sensor; stand-alone monitor IC; thermomechanical stress; Aerospace testing; Application specific integrated circuits; Circuit faults; Condition monitoring; Digital integrated circuits; Electronics packaging; Fault detection; Field programmable gate arrays; Integrated circuit testing; Maintenance;

fLanguage

English

Journal_Title

Instrumentation & Measurement Magazine, IEEE

Publisher

ieee

ISSN

1094-6969

Type

jour

DOI

10.1109/MIM.2010.5521868

Filename

5521868