Title :
Low-Dissipation Silicon Tuning Fork Gyroscopes for Rate and Whole Angle Measurements
Author :
Trusov, Alexander A. ; Prikhodko, Igor P. ; Zotov, Sergei A. ; Shkel, Andrei M.
Author_Institution :
Dept. of Mech. & Aerosp. Eng., Univ. of California, Irvine, CA, USA
Abstract :
We report a new family of ultra high- Q silicon microelectromechanical systems (MEMS) tuning fork gyroscopes demonstrating angular rate and, for the first time, rate integrating (whole angle) operation. The novel mechanical architecture maximizes the Q-factor and minimizes frequency and damping mismatches. We demonstrated the vacuum packaged SOI dual and quadruple mass gyroscopes with Q-factors of 0.64 and 0.86 million at 2 kHz operational frequency, respectively. Due to the stiffness and damping symmetry, the quadruple mass gyroscope was instrumented to measure the angle of rotation directly, eliminating the bandwidth and dynamic range limitations of conventional MEMS vibratory rate gyroscopes. The technology may enable silicon micromachined devices for inertial guidance applications previously limited to precision-machined quartz hemispherical resonator gyroscopes.
Keywords :
Q-factor; angular measurement; damping; elemental semiconductors; gyroscopes; inertial navigation; micromechanical resonators; packaging; silicon; silicon-on-insulator; velocity measurement; vibrations; MEMS; Q-factor; Si; damping mismatch; dual mass gyroscopes; frequency mismatch; inertial guidance application; low dissipation silicon tuning fork gyroscopes; micromachined device; quadruple mass gyroscopes; rate integrating operation; rate measurement; ultra high-q silicon microelectromechanical systems; vacuum packaged SOI; whole angle measurement; Frequency measurement; Gyroscopes; Q factor; Sensors; Silicon; Temperature measurement; Vibrations; Energy dissipation; microelectromechanical systems (MEMS) gyroscope; quality factor; rate integrating; vacuum packaging; whole angle;
Journal_Title :
Sensors Journal, IEEE
DOI :
10.1109/JSEN.2011.2160338