DocumentCode
1256216
Title
Effects of a HfMoN Metal Gate and Self-Aligned Fluorine-Ion Implantation on the Negative-Bias Temperature Instability of pMOSFETs With
Gate Di
Author
Wang, Jer-Chyi ; Peng, Hsing-Kan ; Lai, Chao-Sung ; Chou, Pai-Chi ; Lee, Min-Jer
Author_Institution
Dept. of Electron. Eng., Chang Gung Univ., Taoyuan, Taiwan
Volume
32
Issue
8
fYear
2011
Firstpage
1017
Lastpage
1019
Abstract
The effects of self-aligned fluorine-ion implantation on the negative-bias temperature instability (NBTI) of p-channel metal-oxide-semiconductor field-effect transistors with HfMoN metal gates and Gd2O3 gate dielectrics were investigated. The threshold voltage Vth can be adjusted from -0.8 to - 0.02 V by increasing the nitrogen concentration in the HfMoN metal gates. However, this adjustment degrades the NBTI, and consequently, the Vth shifts are increased by 140 and 500 mV for samples with low (0%) and high (12%) nitrogen concentration, respectively, in the HfMoN metal gates. This degradation of NBTI was improved by fluorine incorporation.
Keywords
MOSFET; fluorine; gadolinium compounds; hafnium compounds; ion implantation; molybdenum compounds; Gd2O3-HfMoN:F; NBTI; Self-Aligned Fluorine-Ion Implantation; gate dielectrics; metal gates; negative-bias temperature instability; nitrogen concentration; p-channel metal-oxide-semiconductor field-effect transistors; pMOSFET; voltage -0.8 V to -0.2 V; Degradation; Logic gates; MOSFETs; Metals; Nitrogen; Silicon; Stress; Fluorine; high-$k$ ; metal gate; negative-bias temperature instability (NBTI); nitrogen;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2011.2157300
Filename
5928382
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