• DocumentCode
    1256241
  • Title

    Space charge characterization for the 21th century

  • Author

    Damamme, G. ; Le Gressus, C. ; De Reggi, A.S.

  • Author_Institution
    CEA, Centre d´´Etudes de Bruyeres-le-Chatel, France
  • Volume
    4
  • Issue
    5
  • fYear
    1997
  • fDate
    10/1/1997 12:00:00 AM
  • Firstpage
    558
  • Lastpage
    584
  • Abstract
    Various methods of characterizing insulating materials by their ability to take up charge, retain it, and release it, are reviewed critically in search of measurable quantities that could be used to predict material behavior under stress up to failure conditions. Space charge characterization data on different types of materials from polymers to inorganic single crystals and ceramics are surveyed. The charging behavior is found to be influenced by many details such as surface condition and residual stresses. The traditional approach of linking dielectric breakdown to an intrinsic critical field for the material is tested against the newly emerging view that breakdown could be linked to space charge trapping at defect sites and to the attendant energetics of the mechanically strained lattice. The characterization process thus requires more care than was previously thought necessary, but after more research should become more predictive
  • Keywords
    electric breakdown; insulation testing; internal stresses; space charge; surface charging; technological forecasting; ceramic; critical field; defect site; dielectric breakdown; failure; inorganic single crystal; insulating material; lattice energetics; mechanical strain; polymer; residual stress; space charge; surface charging; Charge measurement; Crystalline materials; Current measurement; Dielectric breakdown; Dielectric materials; Inorganic materials; Insulation; Residual stresses; Space charge; Stress measurement;
  • fLanguage
    English
  • Journal_Title
    Dielectrics and Electrical Insulation, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9878
  • Type

    jour

  • DOI
    10.1109/94.625645
  • Filename
    625645