Title :
Experimental and statistical analyses of surface-mount technology PLCC solder-joint reliability
Author :
Lau, John H. ; Harkins, Gary ; Rice, D. ; Kral, Jaroslav ; Wells, Betty
Author_Institution :
Hewlett-Packard Lab., Palo Alto, CA, USA
fDate :
12/1/1988 12:00:00 AM
Abstract :
The mechanical integrity of surface-mount technology (SMT) plastic leaded chip carrier (PLCC) solder joints has been studied by a four-point mechanical flexure fatigue test. The effects of printed circuit board (PCB) pad surface composition and testing temperature on solder-joint reliability are emphasized. Three sets of PCBs have been tested, one with Cu-Ni-Sn pad surface metallurgy, one with Cu-Ni-Au, and one with SMOBC/SSC (solder mask over bare copper selective solder coating). The solder composition was the 63 wt.%Sn/37 wt.%Pb eutectic. A two-parameter Weibull distribution was used for the lifetime model for these three products. The uniformity, quality, reliability, and a comparison of these products are discussed. The joints formed on Cu-Ni-Au and SMOBC boards were appreciably more reliable than those formed on the Cu-Ni-Sn board
Keywords :
fatigue testing; packaging; printed circuit testing; soldering; statistical analysis; surface mount technology; Cu-Ni-Au; Cu-Ni-Sn; PCB; PLCC solder-joint; SMOBC/SSC; SMT; Sn-Pb eutectic; four-point mechanical flexure fatigue test; lifetime model; mechanical integrity; pad surface composition; plastic leaded chip carrier; printed circuit board; reliability; statistical analyses; surface-mount technology; two-parameter Weibull distribution; Circuit testing; Copper; Fatigue; Flexible printed circuits; Lead; Plastics; Soldering; Statistical analysis; Surface-mount technology; Temperature;
Journal_Title :
Reliability, IEEE Transactions on
