Preparation, structure, and fracture modes of Pb-Sn and Pb-In terminated flip-chips attached to gold capped microsockets

Author

Puttlitz, Karl J.

Author_Institution

IBM Corp., Hopewell Junction, NY, USA

Volume

13

Issue

4

fYear

1990

fDate

12/1/1990 12:00:00 AM

Firstpage

647

Lastpage

655

Abstract

The effects of using nickel deposited from an electroless phosphorus-based bath as the base metal to achieve solder wetting for chip interconnection is discussed. Specifically discussed are the degradation effects on solder wetting caused by precipitate formation during process thermal exposure, and the use of a gold cap to prevent the problem. The overall metallurgical characteristics of both lead-tin and lead-indium controlled-collapse chip connection joints, as well as their relation to performance (e.g. fracture mode and fatigue life) are discussed. Preliminary processing and microsocket preparation are discussed

Keywords

fatigue; flip-chip devices; fracture; indium alloys; integrated circuit technology; lead alloys; microassembling; packaging; soldering; tin alloys; Au capped microsockets; Ni deposition; PbIn; PbSn terminated flip chips; chip interconnection; controlled-collapse chip connection joints; degradation effects; electroless P bath; electroless plating; fatigue life; fracture modes; metallurgical characteristics; precipitate formation; process thermal exposure; solder bump flip chip connections; solder wetting; Ceramics; Conducting materials; Fatigue; Gold; Lead; Metallization; Nickel; Rendering (computer graphics); Substrates; Thick films;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.62574

Filename

62574