DocumentCode
1257801
Title
Terpene cleaning of electronic assemblies
Author
Wenger, George M. ; Tashjian, Gregory P.
Author_Institution
AT&T Bell Lab., Princeton, NJ, USA
Volume
13
Issue
4
fYear
1990
fDate
12/1/1990 12:00:00 AM
Firstpage
693
Lastpage
697
Abstract
The technology and methods developed to safely spray the semi-aqueous terpene hydrocarbon Bioact EC-7 are described. This technique is used to remove rosin-based solder paste residues after reflow soldering of surface-mount devices to printed circuit board assemblies. The operating experience gained during the implementation of this semi-aqueous terpene hydrocarbon cleaning method is described
Keywords
assembling; organic compounds; printed circuit manufacture; soldering; surface mount technology; surface treatment; Bioact EC-7; electronic assemblies; printed circuit board assemblies; reflow soldering; rosin-based solder paste residues; semi-aqueous terpene hydrocarbon cleaning method; spray; surface-mount devices; Assembly; Biodegradable materials; Biological materials; Cleaning; Hydrocarbons; Printed circuits; Reflow soldering; Solvents; Spraying; Temperature;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/33.62581
Filename
62581
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