Title :
Terpene cleaning of electronic assemblies
Author :
Wenger, George M. ; Tashjian, Gregory P.
Author_Institution :
AT&T Bell Lab., Princeton, NJ, USA
fDate :
12/1/1990 12:00:00 AM
Abstract :
The technology and methods developed to safely spray the semi-aqueous terpene hydrocarbon Bioact EC-7 are described. This technique is used to remove rosin-based solder paste residues after reflow soldering of surface-mount devices to printed circuit board assemblies. The operating experience gained during the implementation of this semi-aqueous terpene hydrocarbon cleaning method is described
Keywords :
assembling; organic compounds; printed circuit manufacture; soldering; surface mount technology; surface treatment; Bioact EC-7; electronic assemblies; printed circuit board assemblies; reflow soldering; rosin-based solder paste residues; semi-aqueous terpene hydrocarbon cleaning method; spray; surface-mount devices; Assembly; Biodegradable materials; Biological materials; Cleaning; Hydrocarbons; Printed circuits; Reflow soldering; Solvents; Spraying; Temperature;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
