Materials/processing approaches to phase stabilization of thermally conductive pastes

Author

Anderson, Herbert R., Jr. ; Booth, Richard B.

Author_Institution

IBM Gen. Technol. Div., Hopewell Junction, NY, USA

Volume

13

Issue

4

fYear

1990

fDate

12/1/1990 12:00:00 AM

Firstpage

713

Lastpage

717

Abstract

An assessment of the phase stability of thermally conductive pastes using both accelerated off-line centrifuge testing and functional testing with high-performance multichip modules is presented. The formulations used to improve the phase stability of thermally conductive pastes exposed to thermomechanical stressing associated with temperature variations during power cycling are shown. The pastes derived from the formulations were characterized and functionally tested. Particle surface modification, materials, and milling are discussed

Keywords

VLSI; cooling; integrated circuit technology; life testing; modules; packaging; soldering; BN; VLSI chips; accelerated off-line centrifuge testing; functional testing; high-performance multichip modules; milling; particle surface modification; phase stability; power cycling; soldering; temperature variations; thermally conductive pastes; thermomechanical stressing; Conducting materials; Life estimation; Milling; Multichip modules; Temperature; Testing; Thermal conductivity; Thermal stability; Thermal stresses; Thermomechanical processes;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.62584

Filename

62584