Title :
Materials/processing approaches to phase stabilization of thermally conductive pastes
Author :
Anderson, Herbert R., Jr. ; Booth, Richard B.
Author_Institution :
IBM Gen. Technol. Div., Hopewell Junction, NY, USA
fDate :
12/1/1990 12:00:00 AM
Abstract :
An assessment of the phase stability of thermally conductive pastes using both accelerated off-line centrifuge testing and functional testing with high-performance multichip modules is presented. The formulations used to improve the phase stability of thermally conductive pastes exposed to thermomechanical stressing associated with temperature variations during power cycling are shown. The pastes derived from the formulations were characterized and functionally tested. Particle surface modification, materials, and milling are discussed
Keywords :
VLSI; cooling; integrated circuit technology; life testing; modules; packaging; soldering; BN; VLSI chips; accelerated off-line centrifuge testing; functional testing; high-performance multichip modules; milling; particle surface modification; phase stability; power cycling; soldering; temperature variations; thermally conductive pastes; thermomechanical stressing; Conducting materials; Life estimation; Milling; Multichip modules; Temperature; Testing; Thermal conductivity; Thermal stability; Thermal stresses; Thermomechanical processes;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
