DocumentCode
1257836
Title
Creep fatigue modeling for solder joint reliability predictions including the microstructural evolution of the solder
Author
Frost, Harold J. ; Howard, Robert T.
Author_Institution
Thayer Sch. of Eng., Dartmouth Coll. Hanover, NY, USA
Volume
13
Issue
4
fYear
1990
fDate
12/1/1990 12:00:00 AM
Firstpage
727
Lastpage
735
Abstract
The effect of microstructural evolution on the mechanical integrity of solder joints is discussed. The modeling of the microstructural evolution processes of precipitation, dissolution, and coarsening of the tin phase for low-tin lead-tin solders is described. Thermal cycling fatigue is discussed. A model for damage accumulation is shown
Keywords
creep; crystal microstructure; dissolving; lead alloys; precipitation; reliability; soldering; thermal stress cracking; tin alloys; PbSn alloys; creep fatigue modelling; damage accumulation model; discontinuous coarsening; dissolution; mechanical integrity; microstructural evolution; precipitation; solder joint reliability; thermal cycling fatigue; Capacitive sensors; Creep; Fatigue; Microstructure; Predictive models; Soldering; Temperature; Thermal expansion; Thermal resistance; Thermal stresses;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/33.62586
Filename
62586
Link To Document