Title :
Creep fatigue modeling for solder joint reliability predictions including the microstructural evolution of the solder
Author :
Frost, Harold J. ; Howard, Robert T.
Author_Institution :
Thayer Sch. of Eng., Dartmouth Coll. Hanover, NY, USA
fDate :
12/1/1990 12:00:00 AM
Abstract :
The effect of microstructural evolution on the mechanical integrity of solder joints is discussed. The modeling of the microstructural evolution processes of precipitation, dissolution, and coarsening of the tin phase for low-tin lead-tin solders is described. Thermal cycling fatigue is discussed. A model for damage accumulation is shown
Keywords :
creep; crystal microstructure; dissolving; lead alloys; precipitation; reliability; soldering; thermal stress cracking; tin alloys; PbSn alloys; creep fatigue modelling; damage accumulation model; discontinuous coarsening; dissolution; mechanical integrity; microstructural evolution; precipitation; solder joint reliability; thermal cycling fatigue; Capacitive sensors; Creep; Fatigue; Microstructure; Predictive models; Soldering; Temperature; Thermal expansion; Thermal resistance; Thermal stresses;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
